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CVE-2023-33063

CISA KEV

Published December 5, 2023 · Updated April 3, 2026

high
Official Description+

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Affected Products

VendorProduct
QualcommMultiple Chipsets

Patch Status

Patch by 2023-12-26

Recommended Actions

  1. Check if your systems use any of the affected products listed above.
  2. Apply vendor patches immediately if available.
  3. This vulnerability is in CISA's Known Exploited Vulnerabilities catalog — prioritize remediation.
  4. Monitor vendor advisories for updates and additional mitigations.
  5. Review logs for indicators of compromise related to CVE-2023-33063.